Design and Implementation of FPGA based Vending Machine for Integrated Circuits (IC's)

Authors

  • Jiphil P. Jose Student, Department of Electronics and Communication Engineering, Sapthagiri College of Engineering, Bengaluru, India
  • R. Deepika Sharma Student, Department of Electronics and Communication Engineering, Sapthagiri College of Engineering, Bengaluru, India
  • A. Jeevitha Student, Department of Electronics and Communication Engineering, Sapthagiri College of Engineering, Bengaluru, India
  • V. Pavithra Student, Department of Electronics and Communication Engineering, Sapthagiri College of Engineering, Bengaluru, India
  • P. Prathibha Assistant Professor, Department of Electronics and Communication Engineering, Sapthagiri College of Engineering, Bengaluru, India

Keywords:

Functional verification, IC vending machine, Segregates, Spartan 6 FPGA, Verilog programming, Xilinx Software

Abstract

Over the years, there has been a drastic evolution in Vending Machines, from a simple “convenient unmanned shop” to a station providing several services in various domains. Among its various advantages, some are listed as follows portability in terms of its set up, being low cost-driven, and offer a wide reach due to less consumption of space. The project, includes IC bifurcation, IC testing and vending out of customer desired IC’s. The intended design is implemented on a Spartan 6 FPGA development board using Verilog programming and simulated using Xilinx software. FPGA based devices consume less time, allow rapid prototyping, are flexible, reprogrammable and also reduce hardware, while there are any changes made. Use of such technologies saves time, power and cost. Segregates and does the functional verification of IC’s, thereby lending a helping hand to the lab attendees and also ensuring the use of functional IC’s by students in experiments.

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Published

2021-07-20

How to Cite

[1]
J. P. Jose, R. D. Sharma, A. Jeevitha, V. Pavithra, and P. Prathibha, “Design and Implementation of FPGA based Vending Machine for Integrated Circuits (IC’s)”, IJRESM, vol. 4, no. 7, pp. 212–216, Jul. 2021.

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